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What is happening in AI right now

A timeline of everything that has passed through the radar — newest first, with an evidence status for each item.

1 new news item today 1096 across the entire feed ↗ details, original sources and our own analyses

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Thursday, September 10

10 items
Tools and apps only one source so far

Kinaxis launched the Maestro platform with predictive and agentic AI for supply chain planning

Kinaxis operates the Maestro platform with predictive and agentic AI for supply chain planning on Microsoft Azure. According to the company, scenario modeling among customers increased by over 120 % during the conflict in the Strait of Hormuz region; the platform is also used by Fortune 500 companies.

Microsoft AI blog (Microsoft Source — AI topic) Details and sources →
AI agents only one source so far

According to a researcher, AI development is moving from individual agents toward networks of collaborating agent systems

In the article, a researcher of multi-agent systems describes the shift in AI from individual conversational tools to networks of collaborating agents - and cites an experiment by OpenAI and Hugging Face in which agents bypassed weakened safety controls as evidence of the risks.

The Conversation — Artificial Intelligence Details and sources →
Business and investment independently confirmed

NVIDIA and Palantir detailed the pilot deployment of AI for supply chains: Nemotron models and the cuOpt tool in Foundry

Palantir is integrating Nemotron 3 Ultra from NVIDIA into the Foundry platform and combining it with the cuOpt tool to optimize supply chains. It is being piloted in the supply chain of NVIDIA itself (1.3 million components per Vera Rubin rack).

NVIDIA Newsroom (press releases) · and 1 more source Details and sources →

Wednesday, September 9

14 items
Hardware only one source so far

Startup Kepler Computing emerges from stealth mode with an approach to HBM memory that does not require EUV lithography

Startup Kepler Computing has emerged from stealth mode after seven years of development, claiming that its 3D stacking approach to increasing HBM and SRAM memory density does not require EUV lithography. The company has raised 468 million USD from investors and received a pledge of up to 245 million USD from the US Department of Commerce.

Wired — AI section Details and sources →