Hardware

České Radiokomunikace is installing five Nvidia DGX B300 servers for 70 million Czech crowns

České Radiokomunikace is installing five Nvidia DGX B300 servers at the Lužice data center near Hodonín. The investment reaches up to 70 million Czech crowns; one server costs 13–14 million and draws up to 15 kW of power, with liquid cooling.

NVIDIA: growing demands of AI applications put pressure on memory and storage

According to NVIDIA, AI applications require the processing of increasingly large datasets and context windows that exceed system memory capacity. Simply increasing storage capacity is not enough, according to the company. You can find details in the source article.

Taiwan and South Korea strengthen control over the production of key AI chips and memory

TSMC in Taiwan controls the production of the most advanced AI chips; according to the government there, the most advanced production is to remain on the island. South Korea is investing about 600 billion USD with Samsung and SK Hynix in new plants - the two companies hold around 80 % of the market for memory used in AI chips.

Runware launched the modular Sonic Inference Pod data center for AI inference

Runware launched Sonic Inference Pod, a modular portable data center for AI inference with water-free cooling that can be built within days. There are 10 pods operating in the USA, Europe, and Asia-Pacific, clients include Higgsfield AI and Wix, and 160 additional locations are available.

European Commission launches competition for seven AI gigafactories, Czech project in Zbraslav has government backing

The European Commission has officially launched a competition to build up to seven AI gigafactories with a budget of 10 billion euros in public funding and over 20 billion euros in private investment. Czechia is also bidding for one with a project in Zbraslav near Prague and partner Multiverse Computing.

New: Specific location of the Czech project: Zbraslav (Prague); Cost of the Czech project: 100 billion Kč; Investment by partner Multiverse Computing: up to 50 million EUR; Planned start of construction: 2027; Capacity of the centres: 100 thousand AI chips per centre

Schneider Electric and AMD presented a reference design for deploying high-density AI infrastructure

Schneider Electric and AMD released a reference design for high-density AI data centers built on the AMD Helios platform – it supports racks up to 246 kW and clusters with up to 10.4 MW of IT capacity, and is intended for both new and retrofitted facilities.